Temp. Setting Range : 18~35¡É
Temp. Control Accuracy : ¡¾0.1¡É
Temp. Uniformity : R¡Â0.1¡É(The wafer surface distribution) 
Cooling Time : within 32sec (150¡É to 23¡É)
Cooling Capacity : Approx. 1000W
Cooling type : PCW & TEC 
Sensor : Pt100§Ù-RTD
Proximity gap : 80~120§­
Plate Material and Surface Treatment : Al 5052, 6061 Hard anodizing
PCW Path Material : SUS 316 pipe(O.D 3/8 inch)
Safety Function : Thermostat(60¡É, Max.)
Outer Dimension : ? 320¡¿H36.0§®