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■ Seren supplier a wide range of highly specialized adhesives, encapsulants, inks and coatings for use in the electronics and fiber optics industries.
Amongst these are a line of microelectronic adhesives and encapsulants.
These materials are high purity, high reliability products manufactured under stringent quality systems to ensure the highest degree of consistency possible.
Seren's microelectronics adhesives include electrically conductive, thermally conductive, and anisotropically conductive adhesives. These products are ideally suited for die attachment, substrate attachment, heat sink attachment and flip chip attachment.
Seren's microelectronics encapsulants include underfill, glob top, and cavity-fill compounds. These products are designed for encapsulation of flip chip, COB, COF, CSP, BGA and TCP devices.
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