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¡á ÇÚµåÆù ¹× ±âŸ CSP/BGA chip ¼Ö´õ º¸°¿ëÀ¸·Î °³¹ßµÇ¾úÀ¸¸ç ±âÁ¸ÀÇ Á¦Ç°°ú Â÷º°ÈµÈ Ư¼ºÀ» °®´Â ¿ì¼öÇÑ Á¦Ç°ÀÌ¸ç ¿ø°¡Àý°¨¿¡ µµ¿òÀÌ µÉ°ÍÀÔ´Ï´Ù.
EZ-240-1 Underfill Epoxy Resin
1. ¼Ò °³ : EZ-240-1Àº ÀϾ×Çü ¿°æȼº ¿¡Æø½Ã ¼öÁöÀÔ´Ï´Ù. EZ-240-1Àº ƯÈ÷ CSP/BGA½ÇÀå½Ã ¼Ö´õ Á¶ÀÎÆ®ÀÇ º¸°¿ë ¾ð´õÇÊ Àç·á·Î¼ °³¹ßµÇ¾úÀ¸¸ç Repair°¡ ¿ëÀÌÇÑ ¿ì¼öÇÑ Á¦Ç°ÀÔ´Ï´Ù. ¿¿¡ÀÇÇØ Rework¼ºÀº ±Í»çÀÇ ¿ø°¡Àý°¨¿¡ Å« µµ¿òÀÌ µÇµµ·Ï ¼³°è µÇ¾ú½À´Ï´Ù. ºÒ·®»ç¿ë¿¡ ÀÖ¾î¼ ½±°Ô ReworkÀÌ °¡´ÉÄÉ ÇÏ¿© ºÒ·®ÀÌ ¹ß»ýÇÑ Á¦Ç°ÀÇ Rework¿¡ ÀÇÇÑ ÀçºÒ·®ÀÌ Àû°Ô ¼³°èµÇ¾î ÀÖ¾î Àç ÀÛ¾÷½Ã Rework ¼öÀ²À» ³ôÇû½À´Ï´Ù. ¶ÇÇÑ »ý»ê °øÁ¤¿¡¼ÀÇ ÀÛ¾÷¿¡ In line process¿¡µµ Àû¿ëÀÌ ¿ëÀÌ Çϵµ·Ï ¼³°è µÇ¾úÀ¸¸ç ºü¸¥ ¼Ó °æÈ Å¸ÀÔÀ¸·Î ÀÎÇÑ ±Í»çÀÇ »ý»ê¼º Çâ»ó¿¡ µµ¿òÀÌ µÇµµ·Ï °³¹ßÇÑ Á¦Ç°ÀÔ´Ï´Ù.
2. Ư ¼º : ÀÚ¼¼ÇÑ »çÇ×Àº Á¦Ç°ÀÇ Data sheet ÂüÁ¶ 2-1. ħÅõ¼Óµµ (Flow rate) Measured flow rate to reach 18mm distance under 0.75inch, 3mil gap, 3/4 overlap width sandwiched with shim types two sheets of glass slide.
Underfill
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Run
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@20¡É
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@40¡É
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@50¡É
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EZ-240-1
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1st
2nd
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3min 50sec
4min
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55sec
55sec
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40sec
40sec
| EZ-240-1 Á¦Ç°Àº ¸ð¼¼°üÇö»ó¿¡ ÀÇÇÑ CSP/BGA Chip°ú PCB»çÀ̸¦ ¿Ïº®ÇÏ°Ô ÃæÁø½ÃÅ°´Â Àû´çÇÑ Ä§Åõ ¹× È帧¼ºÀ» °¡Áö°í ÀÖ´Â Á¦Ç° ÀÔ´Ï´Ù. 2-2. Rework time Measured repair time of cured EZ-240-1 resin with air gun and solder iron. Amount of underfill resin was 0.2gr, 18mm distance under 0.75inch, 3mil gap, 3/4 overlap width sandwiched area.
2-3. Curing Speed °æÈ°øÁ¤¿¡¼ Á¦Á¶°øÁ¤»ó ¿¿¡ÀÇÇÑ PCB ¹× CSP/BGA ChipÀÇ Thermal Stress(¿Àû½ºÆ®·¹½º)¸¦ °¨¼Ò½ÃÅ°±â À§ÇØ ÀϹÝÀûÀ¸·Î Underfill ¼öÁöÀÇ ºü¸¥ ¼Ó°æȸ¦ ¿ä±¸ÇÕ´Ï´Ù. ÀÌ´Â °øÁ¤»óÀÇ ¿¿¡ ³ëÃâµÇ´Â ChipÀÇ ½Å·Ú¼º È®º¸¿Í °ü·ÃÀÌ Àֱ⠶§¹®ÀÔ´Ï´Ù. EZ240-1ÀÇ °æ¿ì´Â ¼Ó °æȼºÀÌ¸ç ¾ÈÁ¤µÈ °æÈ Á¶°ÇÀ» °®µµ·Ï ¼³°èµÇ¾ú½À´Ï´Ù. EZ-240-1 Cure Profile EZ-240-1 Cure Speed @ 100¡É : 16 ºÐ EZ-240-1 Cure Speed @ 120¡É : 13ºÐ EZ-240-1 Cure Speed @ 150¡É : 5ºÐ
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