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Temp. Setting Range : 18~35℃
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Temp. Control Accuracy : ±0.1℃
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Temp. Uniformity : R≤0.1℃(The wafer surface distribution)
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Cooling Time : within 32sec (150℃ to 23℃)
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Cooling Capacity : Approx. 350W
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Cooling type : PCW & TEC
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Sensor : Pt100Ω-RTD
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Proximity gap : 80~120㎛
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Plate Material and Surface Treatment : Al 5052, 6061 Hard anodizing
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PCW Path Material : SUS 316 pipe(O.D 3/8 inch)
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Safety Function : Thermostat(60℃, Max.)
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Outer Dimension : ／◦220×H37.0㎜
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