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Temp. Setting Range : 18~35¡É
Temp. Control Accuracy : ¡¾0.1¡É
Temp. Uniformity : R¡Â0.1¡É(The wafer surface distribution)
Cooling Time : within 32sec (150¡É to 23¡É)
Cooling Capacity : Approx. 200W
Cooling type : PCW & TEC
Sensor : Pt100§Ù-RTD
Proximity gap : 80~120§
Plate Material and Surface Treatment : Al 5052, 6061 Hard anodizing
PCW Path Material : SUS 316 pipe(O.D 3/8 inch)
Safety Function : Thermostat(60¡É, Max.)
Outer Dimension : £¯◦180¡¿H38.0mm
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